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Requirment :
Design
Embedded
Manufacturing
Components
Assembly
Machinery
Consumable
Turk Key
Requirment PCB Assembly
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Layer :
Single Layer
Double Layer
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Flex
Rigid-Flex
Technology :
Through Hole
SMT
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Min Package :
01005
0201
0402
0603
0805
1206
NO SMD
Min IC Pitch :
DIP
SOIC
TSSOP
MSOP
SOT-23
QFN
BGA
NO IC
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